Solder Paste for Reballing and Soldering Applications
- Alloy Composition: Sn63/Pb37
- Particle Size: 20-38 µm
- Weight: 50g
- Leaded Melting Point: 183°C
This solder paste is designed with the ideal viscosity for reballing and soldering tasks, ensuring optimal flow and adhesion. It arrives in a fresh, wet state for easy application.
Application Instructions:
- Apply the paste and spread evenly using a blade.
- Gently scrape off excess paste.
- Use a paper towel to wipe and dry the area.
- Apply heat as required for soldering.
- Always cover the paste container when not in use to prevent it from drying out.
Store at normal room temp to maintain paste quality and performance.
You may also like…
$16.95 – $317.80
This product has multiple variants. The options may be chosen on the product page
Related products
Out of stock
$5.95
This product has multiple variants. The options may be chosen on the product page
$11.95
This product has multiple variants. The options may be chosen on the product page
$8.00
This product has multiple variants. The options may be chosen on the product page
$78.00 – $119.00
This product has multiple variants. The options may be chosen on the product page
$6.50 – $16.95
This product has multiple variants. The options may be chosen on the product page
