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iPhone Reballing Stencils with CPU – Choose from 7 Stencils
Universal Reballing Stencil for BGA chips – Supports 0.3mm 0.35mm 0.4mm 0.5mm Pitch
25,000 Leaded Solder balls for BGA Reballing Choose from 0.35mm, 0.45mm, 0.55mm
Nintendo Switch CPU Reballing Stencil and Fixture + 2 BGA Blades
Grinding Pen for traces repair Chip grind, Cut, Hole + 7 tips – Battery operated
BGA Blades and Handle Ma3.0 Ma2.0 Ma1.0 and Qianli 012
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