$5.95
Leaded Solder balls for BGA Reballing Choose from 3 popular sizes 0.35mm, 0.45mm, 0.55mm Quantity: 25,000 solder balls per container.
Pre-cut Silicon Thermal Pads – Heat Conducting Silica Gel Pre-Cut Thermal Silicone Pads. Place over the area you want to
Samsung BGA Chip Reballing Stencils – 0.12mm SAM1 S8 S8+ Note8 G9500 G955U N9500 Exynos8895 MSM8998 CPU SAM2 S7 G9300
Choose from 8 Different iPad BGA Chip Reballing Stencils iPad air 2020 – A14 iPad A12 / A12X iPad A9
Universal Reballing Stencil for BGA chips – Supports 0.3mm 0.35mm 0.4mm 0.5mm Pitch Silver Color – Flexible and Retains shape.
Soldering Iron Tip Cleaner + Rosin Flux core to prevent Oxidation Copper Wire ball Rosin Bled bottom of the continuer.
Micro soldering practice circuit board. Package includes over 60 SMD/SMT components of different types (Resistors, Transistors, Diodes SOT-32, Chip SOP16).
A desolder braid is used to absorb and remove solder. The connection is heated with a soldering iron and solder
Jumper wires are used to restore broken circuit board pads or traces. Broken pads or torn traces can be restored
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