NF Solder Paste for Reballing and solder work
$16.95
Out of stock
Stock Notifications
Get an email when this item is back in stock.
Solder Paste for Reballing and Soldering Applications
- Alloy Composition: Sn63/Pb37
- Particle Size: 20-38 µm
- Weight: 50g
- Leaded Melting Point: 183°C
This solder paste is designed with the ideal viscosity for reballing and soldering tasks, ensuring optimal flow and adhesion. It arrives in a fresh, wet state for easy application.
Application Instructions:
- Apply the paste and spread evenly using a blade.
- Gently scrape off excess paste.
- Use a paper towel to wipe and dry the area.
- Apply heat as required for soldering.
- Always cover the paste container when not in use to prevent it from drying out.
Store at normal room temp to maintain paste quality and performance.
Related products
NF.Flux Premium Flux . Heat Resistant RoHS3 & J-STD-004B Compliant
Introducing the long-awaited NF.Flux Premium Flux NF.Flux is the next evolution in precision soldering. Engineered for professionals Our new NF.Flux
All-New NF Chisel Tips for T3B and 210 Soldering Stations
Introducing the Long-Awaited Chisel Tips for the 210 Soldering Station Handle After working closely with the manufacturer, we are excited
NF.Sucker Powerful Solder Removing Tool + Extra Nozzle
NF.Mini Soldering Pen Tips – Conical, Bent, Knife
Macbook Air / Pro Reballing Stencils Mac 1 to 9
25,000 Leaded Solder balls for BGA Reballing Choose from 0.35mm, 0.45mm, 0.55mm
Leaded Solder balls for BGA Reballing Choose from 3 popular sizes 0.35mm, 0.45mm, 0.55mm Quantity: 25,000 solder balls per container.
