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Solder Paste for Reballing and Soldering Applications Alloy Composition: Sn63/Pb37 Particle Size: 20-38 µm Weight: 50g Leaded Melting Point: 183°C
Samsung BGA Chip Reballing Stencils – 0.12mm SAM1 S8 S8+ Note8 G9500 G955U N9500 Exynos8895 MSM8998 CPU SAM2 S7 G9300
Choose from 8 Different iPad BGA Chip Reballing Stencils iPad air 2020 – A14 iPad A12 / A12X iPad A9
Macbook Air / Pro BGA Chip Reballing Stencils. Choose from 9 Different Stencils – Mac 1 to 9 Mac 1
CPU RAM BGA Reballing Stencil for iPhones. Choose from 7 Stencils iPhone 12 / Pro / Max / Mini –
Universal Reballing Stencil for BGA chips – Supports 0.3mm 0.35mm 0.4mm 0.5mm Pitch Silver Color – Flexible and Retains shape.
Leaded Solder balls for BGA Reballing Choose from 3 popular sizes 0.35mm, 0.45mm, 0.55mm Quantity: 25,000 solder balls per container.
Nintendo CPU Switch Reballing Stencil + magnetic fixture and holder for perfect rebelling every time. 5pc package includes: Nintendo Switch
RELIFE Double headed Multi function Prying Knife tools 5pcs
New and improved Tools Storage Rack holder. A must have for every shop. Use this all new and updated holder
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